The aim of the project is to develop an optical module prototype that offers the possibility of creating a flexible arrangement of several Bessel beams for drilling a large number of microholes with a high aspect ratio, using a Spatial Light Modulator.
In order to be able to react to changing target patterns (number and arrangement of holes), the system should be able to change the drilling configuration. This is allowed by the use of a LCOS SLM, which can use digital holography for manipulating the shape of a light beam. An important technical aim is that the processing qualities of the drill holes must be independent of the number or position in the processing field. The optical system should be integrated into an existing laser processing machine based on a picosecond and femtosecond laser (depending on the material).
HOLOEYE develops an LCOS Spatial Light Modulator that is specially adapted to the high energy densities of ultrashort pulses. For this purpose, several LCOS versions are being developed with improved reflectivity/irradiation resistance (Laser Induced Damage Threshold, LIDT) for different wavelength ranges: 450 nm, 512 nm, 800 nm and 1030 nm.
The variety of versions / wavelength ranges enables the processing of different types of materials: semiconductors, ceramics, metals, polymers and circuit boards. A focus of the project is the investigation of the irradiation limit and the associated light damage threshold. The goal is to identify the damage caused by irradiation and develop strategies to increase the irradiation resistance of the LCOS SLM displays. Among these strategies are: the identification of highly stable Liquid Crystal (LC) materials, an effective thermal management of the microdisplay, and the development of highly reflective Dielectric Mirror Coatings for the CMOS backplane.
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